Curable resin composition, dry film, cured product, and electronic component
The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. The invention aims to provide a curable resin composition with high thermal discoloration resistance and a cured product thereof. The curable resin composition contains at least the follow...
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| creator | FUKUDA SHINICHIRO MIYABE HIDEKAZU |
| description | The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. The invention aims to provide a curable resin composition with high thermal discoloration resistance and a cured product thereof. The curable resin composition contains at least the following components (A) to (C): (A) a compound having an isocyanurate structure and two or more (meth)acryloyl groups, (B) an epoxy resin having an isocyanurate structure, and (C) a photo-polymerization initiator.
本发明涉及固化性树脂组合物、干膜、固化物和电子部件。[课题]提供：能赋予高的耐热变色性的固化性树脂组合物、和其固化物。[解决方案]一种固化性树脂组合物，其至少含有：下述成分(A)～(C)：(A)具有异氰脲酸酯结构和2个以上(甲基)丙烯酰基的化合物、(B)具有异氰脲酸酯结构的环氧树脂、和(C)光聚合引发剂。 |
| format | Patent |
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本发明涉及固化性树脂组合物、干膜、固化物和电子部件。[课题]提供：能赋予高的耐热变色性的固化性树脂组合物、和其固化物。[解决方案]一种固化性树脂组合物，其至少含有：下述成分(A)～(C)：(A)具有异氰脲酸酯结构和2个以上(甲基)丙烯酰基的化合物、(B)具有异氰脲酸酯结构的环氧树脂、和(C)光聚合引发剂。</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210907&DB=EPODOC&CC=CN&NR=113359389A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210907&DB=EPODOC&CC=CN&NR=113359389A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUDA SHINICHIRO</creatorcontrib><creatorcontrib>MIYABE HIDEKAZU</creatorcontrib><title>Curable resin composition, dry film, cured product, and electronic component</title><description>The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. The invention aims to provide a curable resin composition with high thermal discoloration resistance and a cured product thereof. The curable resin composition contains at least the following components (A) to (C): (A) a compound having an isocyanurate structure and two or more (meth)acryloyl groups, (B) an epoxy resin having an isocyanurate structure, and (C) a photo-polymerization initiator.
本发明涉及固化性树脂组合物、干膜、固化物和电子部件。[课题]提供：能赋予高的耐热变色性的固化性树脂组合物、和其固化物。[解决方案]一种固化性树脂组合物，其至少含有：下述成分(A)～(C)：(A)具有异氰脲酸酯结构和2个以上(甲基)丙烯酰基的化合物、(B)具有异氰脲酸酯结构的环氧树脂、和(C)光聚合引发剂。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzEKAjEQQNE0FqLeYexjsQTBLSUoFmJlv8TJLASyM2GSFN7eQg9g9Zv31-buu4ZXJlCqiQFlKVJTS8IWor5hTnmxgF0pQlGJHZuFwBEoEzYVTvidmLhtzWoOudLu143ZXy9PfztQkYlqCUhMbfKPYXDuOLrTeHb_mA-BbzW3</recordid><startdate>20210907</startdate><enddate>20210907</enddate><creator>FUKUDA SHINICHIRO</creator><creator>MIYABE HIDEKAZU</creator><scope>EVB</scope></search><sort><creationdate>20210907</creationdate><title>Curable resin composition, dry film, cured product, and electronic component</title><author>FUKUDA SHINICHIRO ; MIYABE HIDEKAZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113359389A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUDA SHINICHIRO</creatorcontrib><creatorcontrib>MIYABE HIDEKAZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUDA SHINICHIRO</au><au>MIYABE HIDEKAZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Curable resin composition, dry film, cured product, and electronic component</title><date>2021-09-07</date><risdate>2021</risdate><abstract>The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. The invention aims to provide a curable resin composition with high thermal discoloration resistance and a cured product thereof. The curable resin composition contains at least the following components (A) to (C): (A) a compound having an isocyanurate structure and two or more (meth)acryloyl groups, (B) an epoxy resin having an isocyanurate structure, and (C) a photo-polymerization initiator.
本发明涉及固化性树脂组合物、干膜、固化物和电子部件。[课题]提供：能赋予高的耐热变色性的固化性树脂组合物、和其固化物。[解决方案]一种固化性树脂组合物，其至少含有：下述成分(A)～(C)：(A)具有异氰脲酸酯结构和2个以上(甲基)丙烯酰基的化合物、(B)具有异氰脲酸酯结构的环氧树脂、和(C)光聚合引发剂。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | Curable resin composition, dry film, cured product, and electronic component |
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