Curable resin composition, dry film, cured product, and electronic component

The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. The invention aims to provide a curable resin composition with high thermal discoloration resistance and a cured product thereof. The curable resin composition contains at least the follow...

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Bibliographische Detailangaben
Hauptverfasser: FUKUDA SHINICHIRO, MIYABE HIDEKAZU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. The invention aims to provide a curable resin composition with high thermal discoloration resistance and a cured product thereof. The curable resin composition contains at least the following components (A) to (C): (A) a compound having an isocyanurate structure and two or more (meth)acryloyl groups, (B) an epoxy resin having an isocyanurate structure, and (C) a photo-polymerization initiator. 本发明涉及固化性树脂组合物、干膜、固化物和电子部件。[课题]提供:能赋予高的耐热变色性的固化性树脂组合物、和其固化物。[解决方案]一种固化性树脂组合物,其至少含有:下述成分(A)~(C):(A)具有异氰脲酸酯结构和2个以上(甲基)丙烯酰基的化合物、(B)具有异氰脲酸酯结构的环氧树脂、和(C)光聚合引发剂。