FILMY ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME

The present invention discloses a filmy adhesive for bonding a semiconductor element and a support member on which the semiconductor element is mounted. The filmy adhesive contains a heat-curable resin component and a labelling agent. 本发明公开一种用于黏合半导体元件与搭载所述半导体元件的支承部件的膜状黏合剂。该膜状黏合剂含有热固性树脂成分与流平剂。...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO SHINTARO, OHHIRA HISANORI, TANIGUCHI KOUHEI, KUNITO YUI, NAKAMURA KANAMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention discloses a filmy adhesive for bonding a semiconductor element and a support member on which the semiconductor element is mounted. The filmy adhesive contains a heat-curable resin component and a labelling agent. 本发明公开一种用于黏合半导体元件与搭载所述半导体元件的支承部件的膜状黏合剂。该膜状黏合剂含有热固性树脂成分与流平剂。