Shape memory material and preparation method and application thereof
The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the follo...
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| creator | HUANG MEILIN SHAN YINGFA QIN JIEYAO WU YINGZHU PENG MEITING WU JIAYI HUANG WEIZHEN CAI YONGJIE YANG ZIHANG SU ZIYUE WU HAILIN GUO JIABIN SHEN WANYI HE SHUOHAI ZHENG JINREN YI NINGBO LIN WANJUN LIU LELE |
| description | The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the following steps: S1, mixing epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound, and conducting heating to obtain a mixture; and S2, curing the mixture to obtain the shape memory material. The shape memory material disclosed by the invention has excellent heat resistance; meanwhile, the material still has the storage modulus of 106Pa or above in a high-elastic state; the fracture process of the shape memory material belongs to brittle fracture, the tensile strength of the shape memory material is reduced along with the increase of the content of the trihydroxymethyl alkane compound, and the elongation at break is also slightly reduced; the shape memory material has a good shape fixing rate, a |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113321785A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113321785A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113321785A3</originalsourceid><addsrcrecordid>eNrjZHAJzkgsSFXITc3NL6pUyE0sSS3KTMxRSMxLUSgoSi1ILEosyczPA8qXZOSngIUTCwpyMpMhwiUZqUWp-Wk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0NjYyNDcwtTRmBg1ANBsMw8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Shape memory material and preparation method and application thereof</title><source>esp@cenet</source><creator>HUANG MEILIN ; SHAN YINGFA ; QIN JIEYAO ; WU YINGZHU ; PENG MEITING ; WU JIAYI ; HUANG WEIZHEN ; CAI YONGJIE ; YANG ZIHANG ; SU ZIYUE ; WU HAILIN ; GUO JIABIN ; SHEN WANYI ; HE SHUOHAI ; ZHENG JINREN ; YI NINGBO ; LIN WANJUN ; LIU LELE</creator><creatorcontrib>HUANG MEILIN ; SHAN YINGFA ; QIN JIEYAO ; WU YINGZHU ; PENG MEITING ; WU JIAYI ; HUANG WEIZHEN ; CAI YONGJIE ; YANG ZIHANG ; SU ZIYUE ; WU HAILIN ; GUO JIABIN ; SHEN WANYI ; HE SHUOHAI ; ZHENG JINREN ; YI NINGBO ; LIN WANJUN ; LIU LELE</creatorcontrib><description>The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the following steps: S1, mixing epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound, and conducting heating to obtain a mixture; and S2, curing the mixture to obtain the shape memory material. The shape memory material disclosed by the invention has excellent heat resistance; meanwhile, the material still has the storage modulus of 106Pa or above in a high-elastic state; the fracture process of the shape memory material belongs to brittle fracture, the tensile strength of the shape memory material is reduced along with the increase of the content of the trihydroxymethyl alkane compound, and the elongation at break is also slightly reduced; the shape memory material has a good shape fixing rate, a</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210831&DB=EPODOC&CC=CN&NR=113321785A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210831&DB=EPODOC&CC=CN&NR=113321785A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG MEILIN</creatorcontrib><creatorcontrib>SHAN YINGFA</creatorcontrib><creatorcontrib>QIN JIEYAO</creatorcontrib><creatorcontrib>WU YINGZHU</creatorcontrib><creatorcontrib>PENG MEITING</creatorcontrib><creatorcontrib>WU JIAYI</creatorcontrib><creatorcontrib>HUANG WEIZHEN</creatorcontrib><creatorcontrib>CAI YONGJIE</creatorcontrib><creatorcontrib>YANG ZIHANG</creatorcontrib><creatorcontrib>SU ZIYUE</creatorcontrib><creatorcontrib>WU HAILIN</creatorcontrib><creatorcontrib>GUO JIABIN</creatorcontrib><creatorcontrib>SHEN WANYI</creatorcontrib><creatorcontrib>HE SHUOHAI</creatorcontrib><creatorcontrib>ZHENG JINREN</creatorcontrib><creatorcontrib>YI NINGBO</creatorcontrib><creatorcontrib>LIN WANJUN</creatorcontrib><creatorcontrib>LIU LELE</creatorcontrib><title>Shape memory material and preparation method and application thereof</title><description>The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the following steps: S1, mixing epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound, and conducting heating to obtain a mixture; and S2, curing the mixture to obtain the shape memory material. The shape memory material disclosed by the invention has excellent heat resistance; meanwhile, the material still has the storage modulus of 106Pa or above in a high-elastic state; the fracture process of the shape memory material belongs to brittle fracture, the tensile strength of the shape memory material is reduced along with the increase of the content of the trihydroxymethyl alkane compound, and the elongation at break is also slightly reduced; the shape memory material has a good shape fixing rate, a</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJzkgsSFXITc3NL6pUyE0sSS3KTMxRSMxLUSgoSi1ILEosyczPA8qXZOSngIUTCwpyMpMhwiUZqUWp-Wk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0NjYyNDcwtTRmBg1ANBsMw8</recordid><startdate>20210831</startdate><enddate>20210831</enddate><creator>HUANG MEILIN</creator><creator>SHAN YINGFA</creator><creator>QIN JIEYAO</creator><creator>WU YINGZHU</creator><creator>PENG MEITING</creator><creator>WU JIAYI</creator><creator>HUANG WEIZHEN</creator><creator>CAI YONGJIE</creator><creator>YANG ZIHANG</creator><creator>SU ZIYUE</creator><creator>WU HAILIN</creator><creator>GUO JIABIN</creator><creator>SHEN WANYI</creator><creator>HE SHUOHAI</creator><creator>ZHENG JINREN</creator><creator>YI NINGBO</creator><creator>LIN WANJUN</creator><creator>LIU LELE</creator><scope>EVB</scope></search><sort><creationdate>20210831</creationdate><title>Shape memory material and preparation method and application thereof</title><author>HUANG MEILIN ; SHAN YINGFA ; QIN JIEYAO ; WU YINGZHU ; PENG MEITING ; WU JIAYI ; HUANG WEIZHEN ; CAI YONGJIE ; YANG ZIHANG ; SU ZIYUE ; WU HAILIN ; GUO JIABIN ; SHEN WANYI ; HE SHUOHAI ; ZHENG JINREN ; YI NINGBO ; LIN WANJUN ; LIU LELE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113321785A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG MEILIN</creatorcontrib><creatorcontrib>SHAN YINGFA</creatorcontrib><creatorcontrib>QIN JIEYAO</creatorcontrib><creatorcontrib>WU YINGZHU</creatorcontrib><creatorcontrib>PENG MEITING</creatorcontrib><creatorcontrib>WU JIAYI</creatorcontrib><creatorcontrib>HUANG WEIZHEN</creatorcontrib><creatorcontrib>CAI YONGJIE</creatorcontrib><creatorcontrib>YANG ZIHANG</creatorcontrib><creatorcontrib>SU ZIYUE</creatorcontrib><creatorcontrib>WU HAILIN</creatorcontrib><creatorcontrib>GUO JIABIN</creatorcontrib><creatorcontrib>SHEN WANYI</creatorcontrib><creatorcontrib>HE SHUOHAI</creatorcontrib><creatorcontrib>ZHENG JINREN</creatorcontrib><creatorcontrib>YI NINGBO</creatorcontrib><creatorcontrib>LIN WANJUN</creatorcontrib><creatorcontrib>LIU LELE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG MEILIN</au><au>SHAN YINGFA</au><au>QIN JIEYAO</au><au>WU YINGZHU</au><au>PENG MEITING</au><au>WU JIAYI</au><au>HUANG WEIZHEN</au><au>CAI YONGJIE</au><au>YANG ZIHANG</au><au>SU ZIYUE</au><au>WU HAILIN</au><au>GUO JIABIN</au><au>SHEN WANYI</au><au>HE SHUOHAI</au><au>ZHENG JINREN</au><au>YI NINGBO</au><au>LIN WANJUN</au><au>LIU LELE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Shape memory material and preparation method and application thereof</title><date>2021-08-31</date><risdate>2021</risdate><abstract>The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the following steps: S1, mixing epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound, and conducting heating to obtain a mixture; and S2, curing the mixture to obtain the shape memory material. The shape memory material disclosed by the invention has excellent heat resistance; meanwhile, the material still has the storage modulus of 106Pa or above in a high-elastic state; the fracture process of the shape memory material belongs to brittle fracture, the tensile strength of the shape memory material is reduced along with the increase of the content of the trihydroxymethyl alkane compound, and the elongation at break is also slightly reduced; the shape memory material has a good shape fixing rate, a</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Shape memory material and preparation method and application thereof |
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