Shape memory material and preparation method and application thereof

The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the follo...

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Hauptverfasser: HUANG MEILIN, SHAN YINGFA, QIN JIEYAO, WU YINGZHU, PENG MEITING, WU JIAYI, HUANG WEIZHEN, CAI YONGJIE, YANG ZIHANG, SU ZIYUE, WU HAILIN, GUO JIABIN, SHEN WANYI, HE SHUOHAI, ZHENG JINREN, YI NINGBO, LIN WANJUN, LIU LELE
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a shape memory material as well as a preparation method and application thereof. The shape memory material is prepared from the following raw materials: epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound. The preparation method comprises the following steps: S1, mixing epoxy resin, a formic anhydride compound and a trihydroxymethyl alkane compound, and conducting heating to obtain a mixture; and S2, curing the mixture to obtain the shape memory material. The shape memory material disclosed by the invention has excellent heat resistance; meanwhile, the material still has the storage modulus of 106Pa or above in a high-elastic state; the fracture process of the shape memory material belongs to brittle fracture, the tensile strength of the shape memory material is reduced along with the increase of the content of the trihydroxymethyl alkane compound, and the elongation at break is also slightly reduced; the shape memory material has a good shape fixing rate, a