Manufacturing method of circuit board golden finger and circuit board with golden finger

The invention provides a circuit board golden finger manufacturing method and a circuit board with golden fingers. The method comprises the steps: forming an annular and concave appearance track on a circuit board, wherein the appearance track is arranged outside an area, where a plurality of golden...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN JIEBIAO, JIANG MINQUAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a circuit board golden finger manufacturing method and a circuit board with golden fingers. The method comprises the steps: forming an annular and concave appearance track on a circuit board, wherein the appearance track is arranged outside an area, where a plurality of golden fingers are arranged, of the circuit board in a surrounding mode, and the plurality of golden fingers comprise at least one segmented golden finger arranged close to the appearance track; forming a conductive layer on the circuit board surrounded by the appearance track, and patterning the conductive layer to form a plurality of electroplating reserved areas, a plurality of electroplating leads and at least one artificial finger bonding pad, wherein the plurality of electroplating reserved areas comprise a first electroplating reserved area corresponding to the golden finger and a second electroplating reserved area corresponding to the segmented area of the segmented golden finger, and the fake finger bonding pad