SEMICONDUCTOR PACKAGE

A semiconductor package may include a package substrate, semiconductor chips, signal bumps, and first and second heat dissipation bumps. The semiconductor chips may be stacked on an upper surface of the package substrate, have first and second regions having different heat dissipation efficiencies. The second temperature may be higher than the first temperature. The signal bumps may be arranged between the semiconductor chips. The first heat dissipation bumps may be arranged between the semiconductor chips in the first region by a first pitch. The second heat dissipation bumps may be arranged between the semiconductor chips in the second region by a second pitch narrower than the first pitch. Heat generated from the second region of the semiconductor chips may be dissipated through the second heat dissipation bumps, which may be relatively closely arranged with each other. 提供了一种半导体封装件。所述半导体封装件可以包括封装基底、半导体芯片、信号凸块以及第一散热凸块和第二散热凸块。半导体芯片可以堆叠在封装基底的上表面上，具有呈不同的散热效率的第一区域和第二区域。第二温度可以比第一温度高。信号凸块可以布置在半导体芯片之间。第一散热凸块可以以第一节