PROTECTOR CAP FOR PACKAGE WITH THERMAL INTERFACE MATERIAL

PROTECTOR CAP FOR PACKAGE WITH THERMAL INTERFACE MATERIAL

The invention provides a protector cap for a package with a thermal interface material. A package (100) which comprises an electrically conductive carrier (102), an electronic component (104) on the carrier (102), an encapsulant (106) encapsulating part of the carrier (102) and the electronic compon...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KHOO NEE WAN, KASZTELAN CHRISTIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention provides a protector cap for a package with a thermal interface material. A package (100) which comprises an electrically conductive carrier (102), an electronic component (104) on the carrier (102), an encapsulant (106) encapsulating part of the carrier (102) and the electronic component (104), an electrically insulating and thermally conductive interface structure (108) covering an exposed surface portion of the carrier (102), and a protection cap (110) covering at least part of the interface structure (108). 用于具有热界面材料的封装的保护帽。一种封装(100)，其包括导电载体(102)、在载体(102)上的电子部件(104)、包封载体(102)的一部分和电子部件(104)的包封剂(106)、覆盖载体(102)的暴露表面部分的电绝缘的且导热的界面结构(108)、以及覆盖界面结构(108)的至少一部分的保护帽(110)。