FLEXIBLE COPPER CLAD LAMINATED FILM, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING FLEXIBLE COPPER CLAD LAMINATED FILM

Disclosed are a flexible copper clad laminated film, an electronic device including same, and a method of manufacturing the flexible copper clad laminated film. The flexible copper clad laminated film comprises: a non-conductive polymer substrate; a nickel-containing plating layer located on at least one surface of the substrate; and a copper plated layer positioned on the nickel-containing plated layer, wherein the copper plated layer may have an alteration rate of a full width at half maximum of 0.01 degrees or less that has been calculated by Equation 1 below with respect to the peak of a (111) plane in an X-ray diffraction spectrum. An alteration rate of a full width at half maximum (111) = {(a full width at half maximum after 60 days) - (an initial full width at half maximum)}. 揭示一种挠性覆铜板、一种包含该挠性覆铜板的电子装置，及一种制造该挠性覆铜板的方法。该挠性覆铜板包含：非导电聚合物基板；含镍镀层，其位于该非导电聚合物基板的至少一个表面上；及铜镀层，其位于该含镍镀层上，其中，在一X射线绕射光谱中，该铜镀层相对于一(111)平面的峰值具有藉由数学式1计算为0.01°或更小的半值宽度改变率：半值宽度(111)改变率＝{(在搁置60天之后的半值宽度)-(初始半值宽度)}。