SEMICONDUCTOR DEVICE

Provided is a semiconductor device which suppresses damage of an insulating layer and suppresses degradation of the entire insulating viscous body that is formed between a conductor layer and a heat dissipating member. A semiconductor device 100 includes a semiconductor element 1, a wiring member 2, an insulating layer 3, a conductor layer 4, a heat dissipating member 5, and a sealing member 6. The conductor layer 4 and the insulating layer 3 are stacked in order from the surface on the heat dissipating member 5 side. An insulating viscous body 7 is formed between the conductor layer 4 and the heat dissipating member 5. A conductive projection 10, which is formed in a portion of a region of the insulating viscous body 7, protrudes from one of the conductor layer 4 and the heat dissipating member 5 toward the other but is separated from the other. 提供对绝缘层的损坏进行抑制，并且对在导体层和散热部件之间设置的绝缘粘性体整体劣化进行抑制的半导体装置。半导体装置(100)具有半导体元件(1)、配线部件(2)、绝缘层(3)、导体层(4)、散热部件(5)及封装材料(6)。从散热部件(5)侧的面起依次层叠有导体层(4)和绝缘层(3)。在导体层(4)和散热部件(5)之间设置有绝缘粘性