METHOD OF FORMING FILM STACKS WITH REDUCED DEFECTS

A method of forming a film stack with reduced defects is provided and includes positioning a substrate on a substrate support within a processing chamber and sequentially depositing polysilicon layers and silicon oxide layers to produce the film stack on the substrate. The method also includes supplying a current of greater than 5 ampere (A) to a plasma profile modulator while generating a deposition plasma within the processing chamber, exposing the substrate to deposition plasma while depositing the polysilicon layers and the silicon oxide layers, and maintaining the processing chamber at a pressure of greater than 2 Torr to about 100 Torr while depositing the polysilicon layers and the silicon oxide layers. 提供了一种形成具有减少的缺陷的膜堆叠的方法，并且所述方法包括：将基板定位在处理腔室内的基板支撑件上；以及依序沉积多晶硅层和氧化硅层以在基板上产生膜堆叠。所述方法还包括：在处理腔室内生成沉积等离子体的同时向等离子体分布调制器供应大于5安培(A)的电流；在沉积多晶硅层和氧化硅层的同时将基板暴露于沉积等离子体；以及在沉积多晶硅层和氧化硅层的同时，将处理腔室维持在大于2托到约100托的压力下。