SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

The invention discloses semiconductor devices and methods of manufacturing the semiconductor devices. In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein. 半导体装置及制造半导体装置的方法。在一个实例中，半导体装置包括：衬底，所述衬底包括顶侧、底侧和导电结构；主体，所述主体在所述衬底的所述顶侧上方；电子组件，所述电子组件在所述衬底的所述顶侧上方且邻近于所述主体，其中所述电子组件包括在所述电子组件的顶侧上的接口元件；在所述接口元件上方的盖子以及在所述电子组件的所述顶侧与所述盖子之间的密封件；以及缓冲物，所述缓冲物在所述电子组件与所述主体之间的所述衬底的所述顶侧上。本文中还公开其它实例和相关方法。