HEAT CONDUCTIVE MEMBER AND METHOD FOR MANUFACTURING SAME

Provided are a heat transfer member and a method for manufacturing the same. The heat transfer member is provided with a case that accommodates a working medium and a porous wick structure that transports the working medium. The liquid-absorbing core structure has a thickness of 0.02 mm or more and...

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Hauptverfasser: HAGIWARA YUJI, TADA KIYOSHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Provided are a heat transfer member and a method for manufacturing the same. The heat transfer member is provided with a case that accommodates a working medium and a porous wick structure that transports the working medium. The liquid-absorbing core structure has a thickness of 0.02 mm or more and 0.1 mm or less, and has a void ratio of 51% or more and 80% or less. The housing has a first metal plate that supports the wick structure. The liquid-absorbing core structure includes: a surface layer portion located at a position away from the first metal plate; and a main body part located between the surface layer part and the first metal plate. The surface layer portion has a different structure from the main body portion. 导热构件及其制造方法,导热构件具备容纳工作介质、和传输工作介质的多孔质的吸液芯结构体的壳体。吸液芯结构体具有0.02mm以上0.1mm以下的厚度,并且具有51%以上80%以下的空隙率。壳体具有支撑吸液芯结构体的第1金属板。吸液芯结构体包括:位于远离第1金属板的位置的表层部;和位于表层部与第1金属板之间的主体部。表层部具有与主体部不同的结构。