Method for manufacturing film-forming substrate, film-forming substrate, and surface treatment agent

The invention provides a method for manufacturing a film-forming substrate, a film-forming substrate, and a surface treatment agent. The present invention addresses the problem of providing: a method for producing a film-forming substrate, which is capable of sufficiently improving bleeding of a res...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ICHIHASHI TOMOKO, NISHIE KENJI, FUJII TAKUTO, OKA YUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides a method for manufacturing a film-forming substrate, a film-forming substrate, and a surface treatment agent. The present invention addresses the problem of providing: a method for producing a film-forming substrate, which is capable of sufficiently improving bleeding of a resin composition and adhesion between the resin composition and the surface of a metal substrate; and the like. The present invention provides a method for manufacturing a film-forming substrate in which a film of a resin composition is formed on the surface of a metal substrate, and the like, the method comprising the steps of: an etching step for etching the surface of the metal substrate with a microetchant; a surface treatment step in which a surface treatment agent is brought into contact with the etched surface of the metal substrate to perform surface treatment such that the contact angle of the surface with respect to water is 50-150 DEG; and a film forming step of forming a film of the resin composition on t