Wiring board and electronic device module

A wiring board includes: a metal plate having a first surface and a second surface facing each other, and having at least one through hole penetrating the first surface and the second surface; at least one electrically conductive through-hole disposed in each of the at least one through-hole and spa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SONG JONG-SEOB, CHOI SEOL-YOUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A wiring board includes: a metal plate having a first surface and a second surface facing each other, and having at least one through hole penetrating the first surface and the second surface; at least one electrically conductive through-hole disposed in each of the at least one through-hole and spaced apart from the metal plate; an insulating structure including at least one through-insulator disposed between the at least one via and the at least one conductive punch-through, and first and second insulating layers extending from the at least one through-insulator on the first and second surfaces, respectively, and disposed in a first region surrounding the at least one conductive punch-through; at least one first upper pad disposed on the first insulating layer and electrically connected to the at least one conductive punch-through; at least one first lower pad disposed on the second insulating layer and electrically connected to the at least one conductive punch-through; a second upper pad disposed on the f