Wafer high-speed loading and conveying method and unloading and conveying method

The invention discloses a high-speed wafer loading and conveying method and a high-speed wafer unloading and conveying method. The high-speed wafer loading and conveying method comprises the following steps: 1, transferring a wafer in a wafer box to a wafer receiving mechanism through a wafer output...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DENG XINFU, WU HAIHUA, LIU DAWEI, MAO MINGJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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