Wafer high-speed loading and conveying method and unloading and conveying method

The invention discloses a high-speed wafer loading and conveying method and a high-speed wafer unloading and conveying method. The high-speed wafer loading and conveying method comprises the following steps: 1, transferring a wafer in a wafer box to a wafer receiving mechanism through a wafer output mechanism; 2, transferring the wafer box to a transfer mechanism from a wafer receiving mechanism; 3, transferring the wafer box from one end of the transfer mechanism to the other end of the transfer mechanism; the high-speed unloading and conveying method for the wafer comprises the following steps: 1, transferring the wafer box from one end of a transfer mechanism to one end close to the receiving mechanism; 2, transferring the wafer box to a receiving mechanism from the transfer mechanism; 3, transferring the wafer in the wafer box to the wafer output mechanism by the wafer receiving mechanism. The process is compact, the wafer cleaning efficiency is improved, and the manufacturing cost of wet cleaning equipme