ELECTRO-DEPOSITION OF NANO TWINNED COPPER STRUCTURES

A copper structure having a high density of nano twins is deposited on a substrate. Electroplating conditions for depositing a nano twinned copper structure may include applying a pulsed current waveform that alternates between a constant current and no current, where a duration of no current being applied is substantially greater than a duration of a constant current being applied. In some implementations, the nano twinned copper structure is deposited by applying a pulsed current waveform followed by a constant current waveform. In some implementations, the nano twinned copper structure is deposited on a highly-oriented base layer, where an electroplating solution contains an accelerator additive. In some implementations, the nano twinned copper structure is deposited on a non-copper seed layer. In some implementations, the nano twinned copper structure is deposited at a relatively low flow rate. 在衬底上沉积具有高密度纳米孪晶的铜结构。用于沉积纳米孪晶铜结构的电度条件可包含施加在恒定电流与没有电流之间交变的脉冲电流波形，其中没有施加电流的持续时间明显大于施加恒定电流的持续时间。在一些实现方案中，通过施加脉冲电流波形后