Method and device for testing failure of tin soldering joint of bonding wire type DB connector
The invention discloses a method and device for testing the failure of a tin soldering joint of a bonding wire type DB connector. The method comprises the steps of 1, calibrating and testing mechanical properties of a single tin soldering joint; 2, evaluating and testing the mechanical properties of...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a method and device for testing the failure of a tin soldering joint of a bonding wire type DB connector. The method comprises the steps of 1, calibrating and testing mechanical properties of a single tin soldering joint; 2, evaluating and testing the mechanical properties of the tin soldering joint of the tested DB connector; 3, adjusting the temperature for multiple times, wherein the step 2 is repeated after each temperature adjustment to obtain the failure degree of the tested DB connector at different temperatures; and 4, respectively executing the step 2 under the condition that different currents are conducted, and obtaining the failure degrees of the tested DB connector under the different currents. The mechanical property parameters such as ultimate tension and ultimate torque of the tin soldering joint part can be tested. According to the invention, the failure condition of the tin soldering joint is evaluated under the condition of coupling of multiple factors such as therma |
---|