Method and device for testing failure of tin soldering joint of bonding wire type DB connector

The invention discloses a method and device for testing the failure of a tin soldering joint of a bonding wire type DB connector. The method comprises the steps of 1, calibrating and testing mechanical properties of a single tin soldering joint; 2, evaluating and testing the mechanical properties of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG RENHONG, ZHENG YUBING, MENG ZHEN, SUN KEJIA, GU XIAOGENG, LIN YIHONG, YE JUNTONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a method and device for testing the failure of a tin soldering joint of a bonding wire type DB connector. The method comprises the steps of 1, calibrating and testing mechanical properties of a single tin soldering joint; 2, evaluating and testing the mechanical properties of the tin soldering joint of the tested DB connector; 3, adjusting the temperature for multiple times, wherein the step 2 is repeated after each temperature adjustment to obtain the failure degree of the tested DB connector at different temperatures; and 4, respectively executing the step 2 under the condition that different currents are conducted, and obtaining the failure degrees of the tested DB connector under the different currents. The mechanical property parameters such as ultimate tension and ultimate torque of the tin soldering joint part can be tested. According to the invention, the failure condition of the tin soldering joint is evaluated under the condition of coupling of multiple factors such as therma