Simplified process for producing an anticorrosive paint with a good adhesiveness and workpieces thus obtained

PCT No. PCT/EP94/02872 Sec. 371 Date May 23, 1996 Sec. 102(e) Date May 23, 1996 PCT Filed Aug. 31, 1994 PCT Pub. No. WO95/07319 PCT Pub. Date Mar. 16, 1995A simplified process for producing a corrosion-protecting, well adhering lacquer coating, and the workpieces obtained thereby, is described. The...

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Hauptverfasser:	K. G. KERLIN, P. HAMACHER
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES APPARATUS THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FILLING PASTES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION USE OF MATERIALS THEREFOR WOODSTAINS
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Zusammenfassung:	PCT No. PCT/EP94/02872 Sec. 371 Date May 23, 1996 Sec. 102(e) Date May 23, 1996 PCT Filed Aug. 31, 1994 PCT Pub. No. WO95/07319 PCT Pub. Date Mar. 16, 1995A simplified process for producing a corrosion-protecting, well adhering lacquer coating, and the workpieces obtained thereby, is described. The process comprises subjecting a metal substrate to a pre-treatment by spray or dip phosphate treatment and without subsequent passivation treatment, optionally after a drying, carrying out an electrophoretic dip lacquer coating of the metal substrate treated in this way wherein an electro dip lacquer is used which contains bismuth in the form of an organic bismuth complex and/or a bismuth salt of an organic carboxylic acid in a content of 0.1 to 5 wt. % calculated as bismuth and related to the binder solids in the electro dip lacquer.