Method for observing unsealed sample of semiconductor device

The invention relates to a method for observing an unsealed sample of a semiconductor device. The method comprises the following steps: unsealing the semiconductor device to obtain an unsealed sample; cleaning the unsealed sample; providing a mold with a containing groove formed in the top, placing the cleaned unsealed sample in the containing groove of the mold, adding clear water into the containing groove, and immersing the unsealed sample in the clear water; and placing the mold under a microscope, and observing the unsealed sample by using the microscope through clear water so as to complete the detection of the unsealed sample. According to the observation method, the unsealed sample is placed in the clear water, the unsealed sample is observed through the clear water, and the surface of the unsealed sample is infiltrated by the clear water, so that the surface roughness of the semiconductor device during imaging can be reduced, the image of the unsealed sample under the microscope is clearer, repeated