Ultrathin and ultra-hard resin grinding wheel for high-speed cutting and preparation method of ultrathin and ultra-hard resin grinding wheel

The invention belongs to the technical field of grinding tool grinding, and particularly relates to an ultrathin and ultra-hard resin grinding wheel for high-speed cutting and a preparation method thereof. The ultrathin and ultra-hard resin grinding wheel for high-speed cutting comprises the following raw materials in parts by volume: 30-55 parts of phenolic resin, 15-25 parts of nickel-plated diamond, 10-20 parts of copper powder, 1-2 parts of sodium stearate and 10-25 parts of silicon carbide whiskers. The grinding wheel is used for precisely cutting glass, ceramic, semiconductor packaging materials and the like, so that the cutting and grinding linear speed of the grinding wheel can be increased, and therefore, the cutting efficiency of the grinding wheel is improved, and the service life of the grinding wheel is prolonged. 本发明属于磨具磨削技术领域，具体涉及一种高速切割用超薄超硬树脂砂轮及其制备方法。所述高速切割用超薄超硬树脂砂轮，包括以下体积份数的原料：酚醛树脂30-55份，镀镍金刚石15-25份，铜粉10-20份，硬脂酸钠1-2份，碳化硅晶须10-25份。本发明用于玻璃、陶瓷、半导体封装等材料的精密划切，能够提升砂轮的切割磨削线速度，从而提高砂轮的切割效率和使用寿命。