DEVICE SEALING METHOD

An electronic device sealing method includes the steps: preparing a device substrate that has a cavity for forming a device, an edge formed higher than the cavity so as to surround the cavity, and an electrode extraction groove at (a portion of) the edge; preparing a cover substrate; forming an elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MATSUMOTO YOSHIIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY
Online-Zugang:	Volltext bestellen
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