DEVICE SEALING METHOD

An electronic device sealing method includes the steps: preparing a device substrate that has a cavity for forming a device, an edge formed higher than the cavity so as to surround the cavity, and an electrode extraction groove at (a portion of) the edge; preparing a cover substrate; forming an electronic device in the cavity of the device substrate; forming in the groove a lead-out wiring led out from the electronic device; forming an inorganic material thin film on surfaces of the device substrate and of a cover glass, at least a surface of the edge of the device substrate and at a portion, of the surface of the cover substrate, to which the edge of the device substrate is joined; and joining the device substrate and the cover substrate with the inorganic material thin film therebetween. 一种电子器件的密封方法，包括：准备器件基板，上述器件基板具有用于器件形成的腔室、包围腔室且比腔室高地形成的缘部及形成于缘部(的一部分)的电极取出用的槽；准备盖体基板；在器件基板的腔室内形成电子器件；将来自电子器件的引出配线形成于槽内；在器件基板和盖体玻璃的表面，至少在器件基板的缘部的表面和盖体基板的表面的供器件基板的缘部接合的部分形成无机材料薄膜；及经由无机材料薄膜而将器件基板与盖体基板接合。