Highly heat-resistant thermoplastic resin composition and molded article manufactured therefrom

The invention provides a thermoplastic resin composition which has excellent heat resistance, mechanical properties and close adhesiveness to a different material, i.e., a reinforcing fibrous base material, and can provide a molded article having excellent stiffness particularly at a higher temperature. A thermoplastic resin composition comprising (A) a phenoxy resin having a hydroxy group and/or an epoxy group at a polymer chain terminal thereof and (B) a polyamide resin, the thermoplastic resin composition being characterized in that the content ratios of the phenoxy resin (A) and the polyamide resin (B) are 50 to 90% by mass and 10 to 50% by mass, respectively, relative to the total amount, i.e., 100% by mass, of the phenoxy resin (A) and the polyamide resin (B), and the tensile modulus retention rate [formula (i)] calculated from a tensile modulus (M) which is measured at 80 DEG C using a dumbbell-shaped test specimen (JIS K 7139, type A1) manufactured by the injection molding of the thermoplastic resin c