ORTHODONTIC INDIRECT BONDING APPARATUS

An orthodontic indirect bonding apparatus including integral custom bracket bonding pads and methods of making. The indirect bonding apparatus includes a receptacle having a frame at least partially surrounding the custom bracket bonding pad perimeter, the receptacle joined to the bracket bonding pa...

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Bibliographische Detailangaben
Hauptverfasser: RABY RICHARD E, STENERSEN KATHLEEN M, GRAHAM JAMES L. II
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An orthodontic indirect bonding apparatus including integral custom bracket bonding pads and methods of making. The indirect bonding apparatus includes a receptacle having a frame at least partially surrounding the custom bracket bonding pad perimeter, the receptacle joined to the bracket bonding pad with a sprue and configured to receive a tooth. The custom bracket bonding pad is configured to complement contours of a portion of the tooth surface. The bracket bonding pad is formed integrally with the receptacle. 本发明提供了包括一体式定制托槽粘结垫的正畸间接粘结设备及其制造方法。该间接粘结设备包括具有至少部分地环绕定制托槽粘结垫的周边的框架的接纳部,该接纳部利用注入口接合到托槽粘结垫并被构造成接纳牙齿。定制托槽粘结垫被构造成与牙齿表面的一部分的轮廓互补。该托槽粘结垫与接纳部一体形成。