Printed circuit board and wiring layout method thereof
The invention provides a printed circuit board and a wiring method thereof. A packaging region of the printed circuit board is provided with a left-right wire outlet region and an upper-lower wire outlet region; in the left wire outlet region and the right wire outlet region, first grounding via hol...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a printed circuit board and a wiring method thereof. A packaging region of the printed circuit board is provided with a left-right wire outlet region and an upper-lower wire outlet region; in the left wire outlet region and the right wire outlet region, first grounding via holes are formed in the vertical direction corresponding to two via holes of a high-speed differential wire on the bonding pad device, and a second grounding via hole is formed between the two via holes of the high-speed differential wire on the bonding pad device; in the upper and lower wire outlet regions, a fifth grounding via hole is configured between two via holes of a high-speed differential wire on the bonding pad device; a sixth grounding via hole is arranged between the two high-speed differential lines of the two via holes on the bonding pad device and located in the external region of the bonding pad device; and a connecting line of the fifth grounding via hole and the sixth grounding via hole is perpendic |
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