Semiconductor assembly

The invention discloses a semiconductor assembly. The semiconductor assembly comprises a first wire, a second wire and a third wire; the first wire, the second wire and the third wire are continuous and equipotential wires; and the first wire, the second wire and the third wire only use two conducto...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YE DAXUN, ZHANG JIEBIN, HUANG KAIYI, LUO ZHENGWEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a semiconductor assembly. The semiconductor assembly comprises a first wire, a second wire and a third wire; the first wire, the second wire and the third wire are continuous and equipotential wires; and the first wire, the second wire and the third wire only use two conductor layers of a semiconductor structure. In an intersection interval of the first wire, the second wire and the third wire, the first wire and the second wire intersect once, the first wire and the third wire intersect once, and the second wire and the third wire intersect once. 本发明揭露了一种半导体组件,包含一第一走线、一第二走线以及一第三走线。该第一走线、该第二走线及该第三走线各为连续且等电位的走线。该第一走线、该第二走线及该第三走线仅使用一半导体结构的两个导体层。于该第一走线、该第二走线及该第三走线的一交叉区间内,该第一走线与该第二走线交叉一次,该第一走线与该第三走线交叉一次,且该第二走线与该第三走线交叉一次。