Ultraviolet curing adhesive tape for invisible cutting as well as preparation method and application of ultraviolet curing adhesive tape
The invention provides an ultraviolet curing adhesive tape for invisible cutting and a preparation method and application thereof. The ultraviolet curing adhesive tape comprises a using layer and a protective layer, the using layer is composed of a base material layer and an acrylic acid pressure-se...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an ultraviolet curing adhesive tape for invisible cutting and a preparation method and application thereof. The ultraviolet curing adhesive tape comprises a using layer and a protective layer, the using layer is composed of a base material layer and an acrylic acid pressure-sensitive adhesive layer, when the ultraviolet curing adhesive tape is used, the protective layer is removed, the using layer composed of the base material layer and the pressure-sensitive adhesive layer is attached to a workpiece, and the using layer has the good optical characteristic, and laser can penetrate through the adhesive tape to cut a workpiece. The obtained ultraviolet curing adhesive tape for invisible cutting has good optical performance, can ensure that laser penetrates through the adhesive tape to cut a workpiece, has high initial adhesive force, can ensure that the whole processing procedure is free of chip falling and water seepage, has very low adhesive force after ultraviolet curing, and is easy t |
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