Low-dielectric thermosetting resin composition prepared from silicon-containing polyphenyl ether

The invention provides a low-dielectric thermosetting resin composition prepared from silicon-containing polyphenyl ether. The comprises the following components in parts by weight: 70 to 120 parts of silicon-containing polyphenyl ether resin, 28 to 38 parts of bismaleimide resin, 3 to 16 parts of polystyrene-butadiene resin, 20 to 100 parts of a cross-linking agent, 1 to 5 parts of an initiator, 15 to 30 parts of a flame retardant, 120 to 180 parts of a filler, 0.01 to 0.5 part of an interface bonding agent, 30 to 50 parts of a solvent 1 and 60 to 100 parts of a solvent 2. According to the low-dielectricity thermosetting resin composition provided by the invention, the components are matched for use, so that the thermosetting resin composition has low dielectricity and meets the development requirement of a new technology, and the components used in the low-dielectricity thermosetting resin composition are low in price and suitable for being widely used; and the problem that the price of a low-dielectric the