Method for preparing epoxy resin composite material from circuit board reclaimed material
The invention discloses a method for preparing an epoxy resin composite material from a circuit board reclaimed material. The epoxy resin composite material comprises the following raw materials: 20-30 parts of the circuit board reclaimed material, 30-40 parts of an epoxy resin prepolymer and 10-20...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for preparing an epoxy resin composite material from a circuit board reclaimed material. The epoxy resin composite material comprises the following raw materials: 20-30 parts of the circuit board reclaimed material, 30-40 parts of an epoxy resin prepolymer and 10-20 parts of a curing agent. The method comprises the following steps: A1, crushing the circuit board reclaimed material into small blocks, boiling in a sodium hydroxide solution, washing with water, drying, soaking in an acid solution, and preparing a metal compound precipitate from a soaking solution by a hydrometallurgy method; A2, putting the metal compound precipitate and sulfur powder into a flask, adding DMF, stirring until the metal compound precipitate and the sulfur powder are dissolved, adding a mixed solution of triethylene tetramine and ethylenediamine and polyvinylpyrrolidone, and performing reflux reaction for 5-6 hours at 150-160 DEG C in a nitrogen atmosphere to prepare modified nanocrystals; and step |
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