SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTURING THE SAME

A semiconductor device having alignment pads and a method of manufacturing the same are disclosed. The semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads. 公开了具有对准焊盘的半导体器件以及制造该半导体器件的方法。半导体器件包括半导体衬底，半导体衬底包括在其上布置有多个管芯焊盘和至少一个对准焊盘的主表面，至少一个对准焊盘用于针对半导体晶片探测的光学处理控制。对准焊盘具有比多个管芯焊盘的硬度小的硬度。