Semiconductor device including extension element for air cooling

A semiconductor device includes a semiconductor chip, a connection element configured to mechanically and electrically couple the semiconductor device to a circuit board, wherein the connection element is electrically coupled to the semiconductor chip and arranged in a mounting plane of the semiconductor device, and the semiconductor chip is mounted on the connection element. The semiconductor device further includes an extension element mechanically coupled to the connection element and extending in a direction out of the mounting plane, wherein the extension element is configured for air cooling. 一种半导体装置包括半导体芯片和配置为用于将所述半导体装置机械地和电地耦合至电路板的连接元件。所述连接元件电耦合至所述半导体芯片并且布置在所述半导体装置的安装平面中。所述半导体芯片安装在所述连接元件上。所述半导体装置还包括延伸元件，所述延伸元件机械耦合至所述连接元件并且沿偏离所述安装平面的方向延伸。所述延伸元件配置为用于空气冷却。