Method of forming devices on substrate

Embodiments of the disclosure relate to systems and methods for forming devices on a substrate. For example, a method for forming devices on a substrate can include projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of a substrate; and...

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Bibliographische Detailangaben
Hauptverfasser: LUDOVIC GODET, MEYER TIMMERMAN THIJSSEN RUTGER, EVANS MORGAN, JOSEPH C. OLSEN, FU JINXIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Embodiments of the disclosure relate to systems and methods for forming devices on a substrate. For example, a method for forming devices on a substrate can include projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of a substrate; and projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a second surface of a substrate. In these embodiments, the first surface and the second surface are on opposite sides of the substrate. Therefore, the ion beams can form the devices on both sides of the substrate. 本公开内容的多个实施方式涉及一种用于在基板上形成装置的系统和方法。例如,一种用于在基板上形成装置的方法可以包括从一个或多个离子束腔室投射一个或多个离子束,以在基板的第一表面上形成一个或多个装置,以及从一个或多个离子束腔室投射一个或多个离子束,以在基板的第二表面上形成一个或多个装置。在这些实施方式中,第一表面和第二表面在基板的相对侧上。因此,离子束可以在基板的两侧上形成装置。