RESIN COMPOSITION FOR TEMPORARY FIXING USE, RESIN FILM FOR TEMPORARY FIXING USE, SHEET FOR TEMPORARY FIXING USE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of temporarily fixing the semiconductor wafer onto a support with the temporary fixing material interposed therebetween, a processing step of processing the semiconductor wafer that has been temporarily fixed onto the support, and a separation step of separating the processed semiconductor wafer from the temporary fixing material, the resin composition comprising (A) a thermoplastic resin, (B) a heat-curable resin and (C) a silicone compound, and having a shear viscosity of 4000 Pa.s or less at 120 DEG C, wherein the change ratio of the shear viscosity of the resin composition after the resin composition is allowed to leave under an atmosphere having a temperature of 25 DEG C for seven days is within 30%. 本发明所涉及的临时固定用树脂组合物在半导体晶圆的加工方法中用于形成临时固定材料，所述半导体晶圆的加工方法包括：临时固定工序，经由临时固定材料将半导体晶圆临时固定于支