Temperature cycle test grading evaluation method for assembling process of ball grid array device for space navigation

The invention relates to a temperature cycle test grading evaluation method for an assembling process of a ball grid array device for space navigation. The method comprises the following steps: 1, determining a packaging structure, a material and related parameters of a device; 2, establishing an average viscoplastic strain energy density increment model; 3, establishing a thermal fatigue life prediction model of the ball grid array device assembly structure; and 4, establishing a temperature cycle test grading evaluation scheme of the installation process of the ball grid array device for space navigation. The method is suitable for designing the temperature cycle grading test of the assembling process of the ball grid array device for space navigation, so that the reasonable temperature cycle test of the assembling process of the ball grid array device for space navigation can be designed according to different practical application conditions, and the method belongs to the technical field of grading evalua