RESIN COMPOSITION FOR UNDERFILL, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

The invention provides a resin composition for underfill excellent in flowability, filling property, moldability, temperature cycle resistance and moisture resistance, a highly reliable electronic component device at least partially sealed with the resin composition for underfill and a method for pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HORI HIROSHI, DEGUCHI OUSHI, NOJIRI NAOYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention provides a resin composition for underfill excellent in flowability, filling property, moldability, temperature cycle resistance and moisture resistance, a highly reliable electronic component device at least partially sealed with the resin composition for underfill and a method for producing the electronic component device. The resin composition for underfill comprises (A) epoxy resin, (B) aromatic amine compound, (C) inorganic filler and (D) organic phosphorus compound. 提供一种流动性、填充性、成形性、耐温度循环性和耐湿性优异的底部填充用树脂组合物、以及至少一部分用该底部填充用树脂组合物进行了密封的可靠性高的电子部件装置和该电子部件装置的制造方法。前述底部填充用树脂组合物具体而言为含有(A)环氧树脂、(B)芳香族胺化合物、(C)无机填充材料和(D)有机磷化合物而成的。