Stacked FPC board and mobile phone

The invention discloses a stacked FPC board and a mobile phone. The stacked FPC board comprises a first FPC board which comprises base material layers and an impedance wiring layer arranged between the base material layers, wherein one side of the first FPC board is provided with an electromagnetic wave shielding film; a first adhesive layer which is arranged at the other side of the first FPC board and is opposite to an electromagnetic wave shielding layer; a second FPC board which comprises the base material layers and an impedance line reference layer arranged between the base material layers, wherein the first adhesive layer is clamped between the first FPC board and the second FPC board; a second adhesive layer, wherein the second adhesive layer and the first adhesive layer are respectively arranged at the two opposite sides of the second FPC board; and an FPC board group which comprises stacked third FPC boards and a third adhesive layer arranged between the third FPC boards, wherein the second adhesive