SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

The invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device in one embodiment includes a substrate, a first adhesive layer, a first semiconductor chip, and a second adhesive layer. The first adhesive layer is provided above a first surface of the substrate and includes a plurality of types of resin having different molecular weights and a filler. The first semiconductor chip is provided above the first adhesive layer. The second adhesive layer is provided in at least a part of a first region between the substrate and the first adhesive layer, and the second adhesive layer includes at least one type of resin among the plurality of types of resin having a molecular weight smaller than a molecular weight of other types of resin among the plurality of types of resin, and a filler having a lower concentration than that of the first adhesive layer. 本发明涉及一种半导体装置及其制造方法。本实施方式的半导体装置具备：衬底、第1粘接层、第1半导体芯片、及第2粘接层。第1粘接层设置在衬底的第1面上方，包含分子量不同的多种树脂及填料。第1半导体芯片设置在第1粘接层的上方。第2粘接层设置在衬底与