PACKAGING STRUCTURE, PROCESSOR AND SERVER

A packaging structure, a processor and a server. The packaging structure is used for packaging a chip, and comprises the chip and a heat-conducting fin, wherein the chip and the heat-conducting fin are provided one over the other, a thermal interface material layer is filled between the chip and the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JIANG SHANGXUAN, ZHENG JIANTAO, ZHAO NAN, HUANG CHENGDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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