PACKAGING STRUCTURE, PROCESSOR AND SERVER

A packaging structure, a processor and a server. The packaging structure is used for packaging a chip, and comprises the chip and a heat-conducting fin, wherein the chip and the heat-conducting fin are provided one over the other, a thermal interface material layer is filled between the chip and the heat-conducting fin, and the chip and the heat-conducting fin are in heat-conducting connection by means of the thermal interface material layer. During specific arrangement, a smooth protrusion structure is arranged on the side of the heat-conducting fin facing the chip, and at least part of the thermal interface material layer is filled between the protrusion structure and the chip, such that at least part of the thermal interface material layer wraps the protrusion structure. It can be seen from the above-mentioned description that the protrusion structure is arranged on the heat-conducting fin, thereby reducing the spacing distance between the chip and the heat-conducting fin, such that the thermal interface m