CIRCUIT BOARD FOR RADAR SENSORS HAVING A METAL FILLING STRUCTURE AND METHOD FOR PRODUCING A CIRCUIT BOARD FOR RADAR SENSORS HAVING A METAL FILLING STRUCTURE

The present invention relates to a circuit board (10) for radar sensors comprising a substrate (1) having an upper face (4) and a lower face (3). The circuit board has at least one antenna device (11) which is arranged on the upper face (4) of the substrate (1) and which is formed from a metal layer (2). Furthermore, the circuit board has a filling structure (14) which is arranged on the upper face (4) of the substrate (1) and which is formed from the metal layer (2). The filling structure (14) is arranged at a distance from the antenna device (11) in a surface area of the upper face (4) of the substrate (1), the surface area not being occupied by the antenna device (11). The filling structure (14) has no electrical connection to the antenna device (11). The surface coverage of the filling structure (14) is in a ratio between 50% and 300% of the surface coverage of the antenna device (11). 本发明涉及一种用于雷达传感器的电路板(10)，包括具有上侧(4)和下侧(3)的衬底(1)。电路板具有至少一个布置在衬底(1)的上侧(4)上的天线装置(11)，天线装置由金属层(2)构造。此外，电路板具有布置在衬底(1)的上侧(4)上的填充结构