Electronic assembly

An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface; and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die. 一种电子组件包括：具有第一表面和与第一表面相对的第二表面的衬底；以及被耦合到衬底的多个加强构件。衬底还包括多个衬底互连。该电子组件还包括被安装在衬底的第一表面上的多个半导体裸片。多个半导体裸片经由多个衬底互连彼此电连接。该电子组件还包括被安装在衬底的第二表面上的多个电源模块。每个电源模块与相应的半导体裸片相对设置。