PACKAGING DEVICE

A packaging device is for packaging a chip component on a substrate via a paste and includes: an application unit (16) that applies a paste on a substrate under predetermined application conditions to form an application body; a bonding unit (18) that forms a mounted body which is the substrate havi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OMATA HIROSHI, TSUJI MASATO, MATSUSHITA KOUJI, KINJO TAKAYA, SEKIKAWA AKIRA, NAKAMURA TOMONORI, SAKAMOTO KOKI, URAHASHI AKIRA, NAKANO SHOTA, HIRUMA KEIICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!