PACKAGING DEVICE

A packaging device is for packaging a chip component on a substrate via a paste and includes: an application unit (16) that applies a paste on a substrate under predetermined application conditions to form an application body; a bonding unit (18) that forms a mounted body which is the substrate having a chip component mounted thereon under predetermined mounting conditions via the application body; a first imaging unit (38) that images the application body after applying the paste and before mounting the chip component to obtain first image information; a second imaging unit (42) that images the mounted body after the mounting to obtain second image information; and a control unit (22) that controls the application unit (16), the bonding unit (18), and the first and second imaging units (38), (42) and determines a three-dimensional shape of the application body from the first image information as a first shape and calculates a three-dimensional shape of the mounted body from the second image information as a