PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING
The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode. 本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | USANMAZ YENER OZTAS KAPLAN ZAHIDE GELMEZ BUKET AGAOGLU HASAN AKKAYA ALI |
| description | The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode.
本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡高电流区和低电流区，从而提供均匀镀层。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113166967A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113166967A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113166967A3</originalsourceid><addsrcrecordid>eNrjZDAI8HEM8fRzV_Bw9HN3DVJw8w9S8HcKcfT0Awv6-_q7u_q5-ocGK0AV8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_Q0NjQzMzSzNzR2Ni1AAAMlEmZQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING</title><source>esp@cenet</source><creator>USANMAZ YENER ; OZTAS KAPLAN ZAHIDE ; GELMEZ BUKET ; AGAOGLU HASAN ; AKKAYA ALI</creator><creatorcontrib>USANMAZ YENER ; OZTAS KAPLAN ZAHIDE ; GELMEZ BUKET ; AGAOGLU HASAN ; AKKAYA ALI</creatorcontrib><description>The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode.
本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡高电流区和低电流区，从而提供均匀镀层。</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210723&DB=EPODOC&CC=CN&NR=113166967A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210723&DB=EPODOC&CC=CN&NR=113166967A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USANMAZ YENER</creatorcontrib><creatorcontrib>OZTAS KAPLAN ZAHIDE</creatorcontrib><creatorcontrib>GELMEZ BUKET</creatorcontrib><creatorcontrib>AGAOGLU HASAN</creatorcontrib><creatorcontrib>AKKAYA ALI</creatorcontrib><title>PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING</title><description>The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode.
本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡高电流区和低电流区，从而提供均匀镀层。</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAI8HEM8fRzV_Bw9HN3DVJw8w9S8HcKcfT0Awv6-_q7u_q5-ocGK0AV8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_Q0NjQzMzSzNzR2Ni1AAAMlEmZQ</recordid><startdate>20210723</startdate><enddate>20210723</enddate><creator>USANMAZ YENER</creator><creator>OZTAS KAPLAN ZAHIDE</creator><creator>GELMEZ BUKET</creator><creator>AGAOGLU HASAN</creator><creator>AKKAYA ALI</creator><scope>EVB</scope></search><sort><creationdate>20210723</creationdate><title>PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING</title><author>USANMAZ YENER ; OZTAS KAPLAN ZAHIDE ; GELMEZ BUKET ; AGAOGLU HASAN ; AKKAYA ALI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113166967A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>USANMAZ YENER</creatorcontrib><creatorcontrib>OZTAS KAPLAN ZAHIDE</creatorcontrib><creatorcontrib>GELMEZ BUKET</creatorcontrib><creatorcontrib>AGAOGLU HASAN</creatorcontrib><creatorcontrib>AKKAYA ALI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USANMAZ YENER</au><au>OZTAS KAPLAN ZAHIDE</au><au>GELMEZ BUKET</au><au>AGAOGLU HASAN</au><au>AKKAYA ALI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING</title><date>2021-07-23</date><risdate>2021</risdate><abstract>The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode.
本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡高电流区和低电流区，从而提供均匀镀层。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN113166967A |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T07%3A51%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=USANMAZ%20YENER&rft.date=2021-07-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113166967A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |