PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING

PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING

The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode. 本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: USANMAZ YENER, OZTAS KAPLAN ZAHIDE, GELMEZ BUKET, AGAOGLU HASAN, AKKAYA ALI
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the anode. 本发明涉及一种镀覆挂架(10)，该镀覆挂架通过改变保持待涂覆材料(15)的部件连接件(17)到阳极的距离来均衡高电流区和低电流区，从而提供均匀镀层。