METHOD AND APPARATUS FOR MAINTAINING SURFACE SPEED OF CIRCULAR CUTTING DEVICE

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use. 提供了一种切割装置的公开,该切割装置被配置成在切割轮随着使用而变小时控制切割轮的线速度。

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Hauptverfasser: KORDUS BRYAN J, BUSSAN JOHN EDWARD, CECKOWSKI DOUGLAS A, KEEBLE MICHAEL E, BERANEK SARAH MARIE, CHKAIBAN CHRISTIAN, FRID CHELSEA B, SHTILMAN MICHAEL, JORAY JEFFREY E
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creator KORDUS BRYAN J
BUSSAN JOHN EDWARD
CECKOWSKI DOUGLAS A
KEEBLE MICHAEL E
BERANEK SARAH MARIE
CHKAIBAN CHRISTIAN
FRID CHELSEA B
SHTILMAN MICHAEL
JORAY JEFFREY E
description Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use. 提供了一种切割装置的公开,该切割装置被配置成在切割轮随着使用而变小时控制切割轮的线速度。
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title METHOD AND APPARATUS FOR MAINTAINING SURFACE SPEED OF CIRCULAR CUTTING DEVICE
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