METHOD AND APPARATUS FOR MAINTAINING SURFACE SPEED OF CIRCULAR CUTTING DEVICE

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use. 提供了一种切割装置的公开，该切割装置被配置成在切割轮随着使用而变小时控制切割轮的线速度。

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Bibliographische Detailangaben
Hauptverfasser:	KORDUS BRYAN J, BUSSAN JOHN EDWARD, CECKOWSKI DOUGLAS A, KEEBLE MICHAEL E, BERANEK SARAH MARIE, CHKAIBAN CHRISTIAN, FRID CHELSEA B, SHTILMAN MICHAEL, JORAY JEFFREY E
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use. 提供了一种切割装置的公开，该切割装置被配置成在切割轮随着使用而变小时控制切割轮的线速度。