Photoelectric package and manufacturing method thereof

The invention discloses a photoelectric package and a manufacturing method of the photoelectric package. The photoelectric package comprises a substrate, a photoelectric component, a first packaging colloid and a second packaging colloid. The photoelectric component is arranged on the substrate. The first packaging colloid covers the substrate and is arranged around the photoelectric assembly. The second packaging colloid covers the first packaging colloid and the photoelectric assembly. The first packaging colloid has a highest point position and a lowest point position, and the highest point position is not higher than the surface of the photoelectric assembly. 本申请公开一种光电封装与光电封装的制作方法。光电封装包括基板、光电组件、第一封装胶体以及第二封装胶体。光电组件设置在基板上。第一封装胶体覆盖基板且设置在光电组件周围。第二封装胶体覆盖第一封装胶体以及光电组件。第一封装胶体具有一最高点位置与一最低点位置，最高点位置不高于光电组件的表面。